Implementation Component Inspection Software "SMT Inspection Pro"
After implementation, the soldering defects of the BGA are monitored and alarms are triggered based on the position and information of the warning marks, determining issues such as bridging or foreign objects!
"SMT Inspection Pro" is an inspection software that identifies differences from reference images in solder bridging and foreign objects after BGA mounting, as well as in shape inspection. It compares the same 2D image data of the sample being inspected against the position and brightness data of the good product's 2D perspective image as the original data. If there are differences in the image data, it marks the position with a caution sign as a bridge or foreign object. [Abnormal Detection Examples] ■ Solder Bridge Abnormality Detection ■ Solder Ball Defect Detection ■ Capacitor Position Abnormality Detection ■ Capacitor Defect Detection *For more details, please refer to the related links or feel free to contact us.
- Company：穂高電子
- Price：Other
